Section ExCom and Annual General Meeting, Edinburgh – April 2024
The 2024 spring ExCom meeting was held in the Pentland Suite, Delta Hotels by Marriott Edinburgh on 26th April with almost 30 Officers and Chairs attended in-person, meaning that it was a vibrant and stimulating meeting.
The focus was on strategic planning for the coming two years, with six main topics being discussed:
- Key Issues & Lessons learnt from Chapter Chair & Technical Council
- Strengthening relationship between Section, Society Chapters and Student Branches
- Young Professional Activities
- Strengthening Industry Engagement
- Strengthening Education Activities
- Raising Awareness of Fellows Programme
The continued refresh of the Chapter leadership resulted in the following new Chairs being ratified:
- IEEE Aerospace and Electronic Systems Society: Dr. Julien Le Kernec
- IEEE Electromagnetic Compatibility Society: Dr. Min Zhang
- IEEE Industry Applications Society: Dr. Mohamed Dahidah
- IEEE Signal Processing Society: Prof. Mark Plumbley
- IEEE Solid-State Circuits Society: John Morrissey
- IEEE Reliability and Electronics Packaging Society: Dr. Stoyan Stoyanov
- IEEE Sensors Council: Dr. Paul Wright
- IEEE Systems Council (interim): Dr. Farhad Fassihi
- IEEE Nanotechnology Council: Dr. Lei Xu
The AGM was held virtually, following the ExCom meeting, to allow all members to attend.
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