IEEE DEIS Summer School | Extra High Voltage DC Transmission
Monmouth Monmouth, WalesThe 2023 DEIS summer school takes place this year in the historic county town of Monmouth in Wales, UK
The 2023 DEIS summer school takes place this year in the historic county town of Monmouth in Wales, UK
This talk will provide an overview of Canadian provincial and remote community grids, and a more detailed discussion of Ontario’s power grid, market, and future expansion plans, from an emissions perspective.
A Distinguished Lecture, Decarbonisation Opportunities in the Electric Power Sector to Address Climate Change will be presented by Prof Saifur Rahman, 2023 IEEE President & CEO.
This event is open to anyone with an interest in ICT4Development and exploring opportunities to support local community needs by leveraging technological innovation.
The IEEE International Symposium on Technology and Society (ISTAS) is the flagship conference of the IEEE’s Society on Social Implications of Technology (SSIT).
Early Career Talks aim to expose the participants to novel areas and aspect of engineering in solving real world problems as well as to establish a link for networking, mentorship and to create a connection for research opportunities.
This talk will elaborate on the emerging technology of reconfigurable intelligent surfaces which is envisages to be the enabler of smart wireless environments, offering a highly scalable, low-cost, hardware-efficient, and almost energy-neutral solution for the dynamic control of the propagation of electromagnetic signals, as well as, their transmission and reception.
IEEE COMSOC Distinguished Lecture | Hybrid Reconfigurable Intelligent Surfaces: From Conventional Optimisation to Autonomous Learning by Prof George C Alexandropoulos, University of Athens The IEEE Distinguished Lecturer Program (DLP) is one of the most exciting offerings available to the ComSoc Chapter members and non-members alike. It connects senior IEEE ComSoc members, who are renowned [...]
Chiplet is a chip design method and heterogeneous integration is a chip packaging method which has been generated lots of traction lately.
In this talk ultra-reliable channel modelling and communication techniques are presented for the joint design of control and communication systems based on extreme value theory and artificial intelligence (AI)